Improved SMT capabilities for 2020

Cranston RI Closes out 2019 with more Capabilities

With demand for our printed circuit board assembly, box build, and system integration services growing, our Cranston, RI facility saw an increase in headcount of 18% to 135 employees.

In addition to increased capacity, we’ve also added several new pieces of equipment to our surface mount lines.

Solder Paste Printers

Speed Print SP710 (2019) – 2 units

Moving to new printers has proven to be a paradigm shift for Federal’s solder printing process.  It is believed that up to 84% of test and process failures originate from the solder printing and reflow process.  With these new printers we have experienced immediate improvements.  Improvements specific to the equipment are:

  • Setup has gone from a 100% manual alignments of the stencil to the FAB to 100% automated process
  • Setup time has drastically improved
  • Print repeatability has improved from almost not existent to virtually 100%
  • Qualification process included reprinting the same FAB for the E15015571 10 times without a single defect (per SPI inspection).
  • SPI inspection parameters have been tightened by 50% and the quality of the prints are passing; SPI failures have reduced drastically.
  • Most print failures no longer require washing the original solder paste off and reprinting the FAB to just sending the FAB back through a secondary print and yield 100% pass rate on the SPI
  • Capabilities of secondary application of solder paste has moved 100% from manual application to fully automated  application. as the new printers have post print dispensing capability for locations that require additional paste.

The improvements are not limited to what has been listed and yields down stream in the process are yet to be realized.

BGA Rework


This new washer has increased Federal’s cleaning capabilities.  Prior to this Federal’s capabilities were limited to cleaning water soluble chemistries.  With the industry requirements increasing to have no-clean, RMA, and water soluble (OA) flux residues removed, the previous T12 aqueous inline cleaner does not have the capability due to the listed chemistry surface tension.

With the new T8 wash utilizing a saponifier (detergent) it possesses the ability to overcome the surface tension of these flux residues and cleans the PCB assemblies to current IPC standards.

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