Low-to-mid volume, high mix, and high complexity product require a different approach for PCB assembly operations. We’ve invested in the latest equipment that not only places the smallest, densest components in the industry but does so in an environment of quick changeover and short runs to accommodate our customers' dynamic requirements. Capabilities include:

  • Single- and double-sided
  • Component placement of fine pitch down to 01005.
  • Leaded and lead-free, water soluble, and no clean chemistry combinations
  • PTH with leaded and lead-free wave as well as selective wave soldering
  • Inspection: Inline 3D solder paste inspection (SPI) and statistical analysis, automated optical inspection(AOI), X-ray
  • Test: Power-up flying probe and custom-developed functional test protocols and fixtures
  • Automated conformal coating

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