Low-to-mid volume, high mix and high complexity products require a different approach for printed circuit board assembly and manufacturing. We’ve invested in the latest equipment that not only places the smallest, densest components in the industry but does so in an environment of quick changeover and short runs to accommodate our customers’ dynamic requirements.
Federal Electronics offers circuit board solutions with world class expertise to support the latest technology for OEMs in a variety of verticals. With surface mount technology (SMT), thru-hole and mixed technology capabilities, Federal Electronics is prepared to tackle the toughest circuit card assembly (CCA) challenges no matter the product sizes or complexity. From initial prototype designs through production, we provide top notch quality for each printed wiring board (PWB) assembly with a relentless dedication to quality, performance, and on time delivery. Let Federal Electronics handle your printed circuit board assembly and manufacturing needs.
PCBA Capabilities
- Surface mount technology (SMT)
- Through hole Technology (THT)
- Mixed technology
- Single and double-sided
- Flexible, Rigid, and Rigid-Flex
- Ball grid array (BGA)
- Component placement of fine pitch down to 01005
- Leaded and lead-free solder
- Water soluble, and no clean chemistry combinations
- Rework
- Pin through hole (PTH)
- Leaded and lead-free wave and selective solder
- RoHS and REACH compliance
- Statistical analysis
- Flux Saponifiers
PCBA Equipment
- Screen printers with glue dispensing option – Speed Print
- In-line 3D solder paste inspection (SPI) – Vi Technology
- Pick and place machines – MyData
- Reflow ovens – Heller
- Automated Optical Inspection (AOI) – Vi Technology
- X-ray 3D – Sciencescope
- Wave soldering machines – Speedline
- Selective Solder Machine – Pillarhouse
- Power-up flying probe – Acculogic
- Custom-developed functional test protocols and fixtures
- Automated conformal coating – Specially Coating Systems (SCS)
- In-line PCBA wash system – Aqua Klean Systems
- Through hole cut and clinch insertion machine – Versatec
- Rework Station- Air-Vac
- Clincher – Contact Ultra Clinch
Standards
All PCBA / Printed Wiring Assembly (PWA) manufacturing processes and operations are in accordance with ISO 9001 / 13485 standards and in compliance with the IPC-A-600 and IPC-A-610 Class 2 and Class 3 Acceptability of Printed Boards Standards as well as IPC-J-Std-001 Requirements for Soldered Electrical and Electronic Assemblies.