Federal Electronics Expands Environmental Testing Capabilities with New Extended-Range Thermal Test Chamber

Designed for demanding qualification and reliability applications, the chamber offers programmable temperature cycling and ramp profiles with ±1°C stability, enabling testing aligned with widely recognized industry standards. The system supports key portions of MIL-STD-810, RTCA DO-160, IEC 60068, SAE J1455, and applicable NASA GEVS environmental test procedures.

“This investment strengthens our ability to help customers accelerate product qualification, reduce program risk, and validate performance in real-world operating environments,” said Ed Evangelista, Federal Electronics President. “By combining manufacturing and environmental testing under one roof, we can provide a more streamlined path from prototype through production.”

Customers in aerospace and defense, medical devices, high reliability industrial, and semiconductor capital equipment markets will benefit from faster environmental validation, earlier identification of design vulnerabilities, improved product reliability, and greater supply chain efficiency.

The new capability further enhances Federal Electronics’ vertically integrated manufacturing model, allowing customers to consolidate build, test, and qualification activities with a single U.S.-based partner committed to delivering high-reliability products for mission-critical applications.